SOLVENT CEMENT

APPLICATIONS:

Printed circuit board

Details

1. Thick copper main specifications is from 105μm to 210μm.

2.Product species:NPM, NPME, NPVP series.

3. Having a low surface roughness and high peel strength, high reliability and stability.

Use

Applied to high current, cooling, automotive and other use of the material for the printed circuit board (PCB) manufacturing, including FR-4, FR-5, and other CCL.

FilenameDownloads
ISO-14001 Certificate
IATF 16949
ISO 9001
OHSAS 18001