Halogen Free Tg 180℃ Rigid CCL
APPLICATIONS:
Details
1.Halogen free and environmentally friendly, High Tg, High Stiffness, excellent heat resistance and dimensional stability, Tg180℃, PTE<3.5% 2.Thickness availability: 0.05~1.6mm 3.Material T288>40′, Stiffness: 22Gpa, BT resin system 4.In the continued pursuit of quality, costdown, and environmental-friendliness, every factory is certified to ISO-9001, ISO-14001, and OHSAS-18001
Use
1.CPU, North Bridge, GPU Chipset, CSP, MCP, SD Card, DRAM FC substrates 2.South Bridge Chipset, PBGA wirebonding substrates 3.DDR3 flash memory chipset 4.Thin Form Factor FC Substrates 5.BGA, IC packaging substrates
| Filename | Downloads |
|---|---|
| NPG-180IN_Datasheet |  |
| NPG-180IN_SDS | |
| NPG-180INBK_Datasheet | |
| NPG-180INBK_SDS | |
| NPG-200_Datasheet | |
| NPG-200_SDS | |
| NPG-200W_Datasheet | |
| NPG-200W_SDS | |
| NPG-200WB (Prepreg) | |