Copper Foils for High Frequency Application
APPLICATIONS:
Printed circuit board
Details
1. High Frequency copper foil substrate main specifications is from 12μm to 70μm.
2. Product species：TLC-V, TLC-H series.
3. Has a very low surface roughness and high peel strength.
Use
Applied to low dielectric (Low Dk / Df), communications and other use of the material for the printed circuit board (PCB) manufacturing, including FR-4, FR-5, and other CCL.
| Filename | Downloads |
|---|---|
| ISO-14001 Certificate |  |
| IATF 16949 | |
| ISO 9001 | |
| OHSAS 18001 | |