Copper Foils for FPC Application

APPLICATIONS:

Printed circuit board

Details

1. The copper plate with the main specifications is from 9μm to 70μm.

2. Product species:NPV, VF series suitable coating process.

3. Product species:VFM series suitable lamination process.

4. Etched with good and excellent flex workability.

5. Ultra-low surface roughness and high bonding strength.

Use

Applied to FCCL materials and for flexible printed circuit boards (2-Layer, 3-Layer)

Filename Downloads
ISO-14001 Certificate
IATF 16949
ISO 9001
OHSAS 18001